HIGH PERFORMANCE FILLERS FOR THERMALLY CONDUCTIVE PLASTICS:

The requirements for new and innovative plastics rise continuously. In this, heat-conductive plastics will play an increasingly larger and more important role in the future, because their use creates a number of not insignificant advantages. Apart from the benefits of lightweight construction the use of plastic offers the possibility to manufacture complex geometries by injection moulding quickly and cost efficiently.

Through the addition of special fillers having a high intrinsic thermal conductivity the thermal conductivity of plastic materials can be significantly increased. With the product family SILATHERM^® an effective solution based on mineral fillers for improving the thermal conductivity has been developed. At the same time these fillers have an insulating effect against electric current and improve the mechanical strength.

SILATHERM^® Advance impresses by its whiteness. A distinction is made between the natural color, the density and hardness of the mineral. Furthermore, various grain sizes and mixtures can be prepared. A much better homogenization is achieved with all types by a surface treatment specially adapted to the polymer. This leads to even better mechanical properties and even higher thermal conductivities.

For example in automotives the number of E&E applications in terms of automation and linking is steadily increasing. But also the field of alternative power drives poses potential for heat conductive plastics. The issue of heat generation and their effective conduction is a major challenge in many of these applications. Through the smart combination of plastics and fillers technically and economically viable alternatives to metal solutions can be developed.

SILATHERM^® Plus is a range of thermally conductive fillers with optimized packing density. Very high filling degrees are combined with excellent flow properties. SILATHERM^® Plus is particularly suitable for applications where electrical insulation is associated with higher thermal conductivity.